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Your search returned 22 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2003 Volume number : 26 Issue: 03 |
Study Of The Electrical Performance Of Chip-On-Board (Cob) Devices
(Article)
Subject:
Electrical Performances
,
Flip-Chip
,
Ionic Catalysis
Author:
Nathapong
Suthiwongsunthorn
Neviana
Kilbey
page:
503
-
508
Failure Mechanism Study Of Anisotropic Conductive Film (Acf) Packages
(Article)
Subject:
Fine Particles (Mastic)
,
Reliability
,
Moisture Probe
,
Flip-Chip
Author:
Lei L.
Mercado
Jerry
White
Vijay
Sarihan
page:
509
-
516
Printed Microniductors On Flexible Substrates For Power Applications
(Article)
Subject:
Inductor
,
Integrated Passive Component
,
Printed Circuit Board
Author:
Erik J.
Brandon
Wiliam B.
Kuhn
page:
517
-
523
Environmental Aging And Deadhesion Of Siloxane-Polyimide-Epoxy Adhesive
(Article)
Subject:
Accelerated Testing
,
Adhesive
,
Delamination
Author:
Steven
Murray
Michael G.
Pecht
page:
524
-
531
Heat Transfer Analysis And Simplified Thermal Resistance Modeling Of Linear Motor Driven Stages For Smt Applications
(Article)
Subject:
Chip Mounter
,
Finite - Element Analysis
,
Heat Transfer
,
Linear Motor
Author:
Changsoo
Jang
Jong Young
Kim
Jae Ok
Kim
page:
532
-
540
Active Fiber-Solder-Ferrule Alignment Method For High-Performance Opto-Electronic Device Packaging
(Article)
Subject:
Active Alignment
,
Fiber Alignment Shift
,
Optoelectronic
Author:
Yih-Tun
Tseng
Yung-Ching
Chang
page:
541
-
547
Determining The Impact Resistance Of Electrically Conductive Adhesives Using A Fallling Wedge Test
(Article)
Subject:
Double Cantilever Beam
,
Electrically Small Antennas
,
Impact Resistance
Author:
Shuangmei
Xu
David A.
Dillard
page:
554
-
562
Humidity And Reflow Resistance Of Flip Chip On Foil Assemblies With Conductive Adhesive Joints
(Article)
Subject:
Conductive Adhesive
,
Flip Chi P
,
Flexible Structure
Author:
J. Hans De
Vries
Esther
Janssen
page:
563
-
568
Disk-Shaped Miniature Heat Pipe (Dmhp) With Radiating Micro Grooves For A To Can Laser Diode Package
(Article)
Subject:
Heat Spreading
,
Micro Graphite
Author:
Hsin-Tang
Chien
Da-Sheng
Lee
Ping-Hei
Chen
page:
569
-
574
Heat Transfer And Residual Stress Modeling Of A Diamond Film Heat Sink For High Power Laser Diodes
(Article)
Subject:
Diamond
,
Finite - Element Analysis
,
Heat Transfer
,
Telecommunication
Author:
Marko
Labudovic
Michael
Burka
page:
575
-
590
High Quality Ltcc Resonator For Voltage-Controlled Oscillator
(Article)
Subject:
Integrated Passive Component
,
Integrated Process Across
Author:
Tomas
Prochazka
Ruth
Manner
Richard
Matz
page:
591
-
597
Thermal Design Methodologg For High Heat Flux Single Phase And Two Phase And Two-Phase Micro Channel Heat Sinks
(Article)
Subject:
Boiling
,
Pressure Drop
,
Phase Change
Author:
Wei-Li
Qu
I
Mudawar
page:
598
-
609
Compact Conduction Model Of Ball Grid Array Packages
(Article)
Subject:
Bga
,
Ccm
,
Compact Modeling
,
Impedance
Author:
Gaml
Refai-Ahmed
Kamalakannan
Venkatesan Karimanal
page:
610
-
615
Lead-Free Soldering In The Japanese Electronics Industry
(Article)
Subject:
Green Materials
,
Lead -Free
,
Recycling
Author:
Yuki
Fukuda
Michael G.
Pecht
K
Fukuda
page:
616
-
624
A Life Consumption Monitoring Methodology For Electronic Systems
(Article)
Subject:
Humidity
,
Life Consumption
,
Vibration
Author:
Arun
Ramakrishnan
Michael G.
Oecht
page:
625
-
634
The Microstructure Investigation Of Flip-Chip Laser Diode Bonding On Silicon Substrate By Using Indium-Gold Solder
(Article)
Subject:
Flip Chip
,
High Temperature Steam
,
Thermal Shocking
,
Soldering Error
Author:
Chien-Chih
Liu
Yen-Kuang
Lin
Yeong-Her
Wang
page:
635
-
641
High Frequency Cable Connector For Twisted Pair Cables
(Article)
Subject:
Elastomer Interconnect
,
High Frequency
,
Mpi
Author:
W. Peter
Siebert
page:
642
-
650
Formation And Growth Kinetics Of Interfacial Intermetallics In Pb-Free Solder Joint
(Article)
Subject:
Intermetallic Compound
,
Lead-Ffree
,
Solder Joint Reliability
Author:
G.
Li
B. L.
Chen
page:
651
-
658
Prediction Of Rate-Independent Constitutive Behavior Of -Pb-Free Sikders Based Ib First Principles
(Article)
Subject:
Heterogeneous
,
Hybrid
,
Plastic Slip
Author:
P.
Sharma
A.
Dasgupta
J.
Loman
page:
659
-
666
Molecular Basis Of The Interphase Dielectric Properties Of Microelectronic And Optoelectronic Packaging Materials
(Article)
Subject:
Dielectric Constant
,
Dipole Moment
,
Polarization
,
Optoelectronic
Author:
Micheal G.
Todd
Frank G.
Shi
page:
667
-
672
Numerical Simulation Of Stress Evolution During Electromigration In Ic Interconnect Lines
(Article)
Subject:
Deviatoric Stress Tensor
,
Stress Erianic Concrete
,
Pdes
Author:
H
Ye
Cemal
Basaran
Douglas C.
Hopkins
page:
673
-
681
Open Forum
(Article)
Subject:
China
,
Commercial Construction
,
Outsourcing
Author:
Michael G.
Pecht
page:
682
-
686
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